Hsinchu, Aug. 28 (CNA) — A record number of exhibitors will participate this year in SEMICON Taiwan, an annual international trade fair for semiconductor technology that opens Sept. 4 in Taipei, organizer SEMI said Wednesday.
The annual event will feature more than 3,600 booths from over 1,100 exhibitors from home and abroad, the highest number since the first event in 1996, according to SEMI, a Hsinchu-based organization that connects about 3,000 member companies and 1.5 million professionals from around the world to advance technology and business in electronics design and manufacturing.
Ray Yang (楊瑞臨), an international consulting director for strategy development at the government-funded Industrial Technology Research Institute (ITRI) and committee member at SEMI Taiwan, said the theme of this year’s event is “Limitless Empowerment of Artificial Intelligence” and highlights the importance of silicon photonics and fan-out panel-level packaging (FOPLP).
During the event, a forum focusing on silicon photonics will be held, where experts from organizations and companies such as Taiwan Semiconductor Manufacturing Co. (TSMC), Inter-university Microelectronic Centre and Marvell will discuss the opportunities and challenges of silicon photonics, Yang added.
Silicon photonics, known for its high bandwidth, low power consumption, long-distance transmission and cost savings, has become a hot topic in the semiconductor industry. It is estimated that the global silicon photonics market could reach $7.86 billion by 2030.
In addition, a forum on FOPLP will be held, where experts from AppliedMaterials, Manz and Advanced Semiconductor Engineering, Inc. will discuss and examine related technological developments.
Driven by demand for 5G, artificial intelligence of things, automobiles, high-performance computing and consumer products, FOPLP has significant growth potential. According to research firm Yole, the market is expected to reach $221 million by 2028, with a compound annual growth rate of 32.5 percent from 2023 to 2028.
Meanwhile, several senior managers of TSMC, including Executive Vice President and Co-Chief Operating Officer YJ Mii (米玉傑), Vice President of Pathfinding and Corporate Research Min Cao (曹敏), Vice President of Advanced Packaging Technology and Service Jun He (何軍) and Director of Advanced Packaging Business Development Jerry Tsou (鄒覺倫), will deliver speeches in various forums during the event, Yang said.
He added that this year’s exhibition will have 13 country sections, with France, Malaysia and the Philippines new to the list.
SEMICON Taiwan will take place from September 4 to 6 at the Taipei Nangang Exhibition Center.
